72079G
Low Cost Flip Chip Technologies for DCA, Wlcsp, and PBGA Assemblies, 1st Edition

Published: 2000
Pages: 585
Editors: John H. Lau
Publisher: McGraw-Hill Professional
ISBN 10: 0071351418
ISBN 13: 9780071351416

Price: $120.00 OUT OF STOCK!

The first comprehensive and in-depth guide to low-cost flip chip technologies, this reference gives you cutting edge information on the most important new developments and latest research results in applying flip chip technologies to direct chip attach (DCA) - also called flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in flip chip research and development, those who wish to master flip chip problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field.

This one-stop guide meets the reference needs of engineers in the fields of design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the economic, design, materials, process, equipment, quality, manufacturing, and reliability issues of low-cost flip chip technologies.

• IC trends and packaging technology updates
• More than 12 different wafer-bumping methods
• More than 100 lead-free solder alloys
• Sequential build up PCB with microvias and via-in-pad
• FCOB with anisotropic conductive film (ACF)
• FCOB with anisotropic conductive adhesive (ACA)
• Solder-bumped FCOB with conventional underfills
• Solder-bumped FCOB with no-flow underfills
• Solder-bumped FCOB with imperfect underfills
• Physical and mechanical properties of underfills
• How to select underfill materials
• Thermal management of solder-bumped FCOB
• Reliability of solder-bumped FCOB
• Failure analysis of solder-bumped FCOB
• Design, materials, process, and reliability of WLCSPs
• Solder-bumped flip chip in PBGA packages
• Fracture mechanics analysis of delaminations
• Creep analysis of solder joints

Low-cost flip chip technology is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Low-Cost Flip Chip Technologies For DCA, WLCSP, and PBGA Assemblies, you'll see why it's the resource of choice for those who want to be at the top of the game.

From the Back Cover

The first comprehensive and in-depth guide to low cost flip chip technologies, this reference gives you cutting edge information on the most important new developments and latest research results in applying flip chip technologies to direct chip attach (DCA), e.g., flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in flip chip research and development, those who wish to master flip chip problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field. This one-stop guide meets the reference needs of engineers in the fields of design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the economic, design, materials, process, equipment, quality, manufacturing, and reliability of issues of low cost flip chip technologies. Among the topics explored: IC trends and packaging technology updates; more than 12 different wafer-bumping methods; more than 100 lead-free solder alloys; sequential build up PCB with microvias and via-in-pad; FCOB with anisotropic conductive film (ACF); FCOB with anisotropic conductive adhesive (ACA); solder-bumped FCOB with conventional underfills; how to select underfill materials; thermal management of solder-bumped FCOB; reliability of solder-bumped FCOB; failure analysis of solder-bumped FCOB; design, materials, process, and reliability of WLCSPs; solder-bumped flip chip in PBGA packages; fracture mechanics analysis of delaminations; creep analysis of solder joints. Low cost flip chip technology is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies, you'll see why it's the resource of choice for those who want to be at the top of the game.