9105
Microelectronic Failure Analysis Desk Reference, 4th Edition
Edited by: Technical Editors: Richard J. Ross and Christian Boit; Executive Editor: Donald Staab; Hardbound; Publisher: ASM; Publication Date: 1999; ISBN 0-87170-638-5; 643 pages
$195.00

This updated reference book, prepared by experts in their fields, contains 60 articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most frequently needed information on this subject at your fingertips.

Developments over the past six years have been covered in this expanded text, while previously covered topics have been revisited with a fresh perspective. New material includes fault isolation and characterization, as well as state-of-the-art techniques to analyze the die from the backside.

Contents:
• Overall View of Failure Analysis of Microelectronic Devices
• Test-and-Fail Verification
• Decapsulation and Package Analysis
• Electrical Techniques
• Electron/Ion-Beam Based Techniques
• Thermal Techniques
• Photonic Techniques
• Software Techniques
• Deprocessing and Sample Preparation
• Physical/Chemical Defect Characterization
• Discrete/Passive Component Analysis
• Failure Modes and Mechanisms
• Advance Techniques
• Laboratory Operations and Management