ASTM Book of Standards (Print and CD-ROM)
Volume 10.04, April 2007
Electronics; Declarable Substances in Materials

Table of Contents

F0001-03 Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes
F0003-02A Specification for Nickel Strip for Electron Tubes
F0004-66R05 Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes
F0007-95R06 Specification for Aluminum Oxide Powder
F0015-04 Specification for Iron-Nickel-Cobalt Sealing Alloy
F0016-67R06 Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
F0018-64R06 Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
F0019-64R05E01 Test Method for Tension and Vacuum Testing Metallized Ceramic Seals
F0029-97R02 Specification for Dumet Wire for Glass-to-Metal Seal Applications
F0030-96R02 Specification for Iron-Nickel Sealing Alloys
F0031-05 Specification for 42 \% Nickel-6 \% Chromium-Iron Sealing Alloy
F0044-95R06 Specification for Metallized Surfaces on Ceramic
F0072-06 Specification for Gold Wire for Semiconductor Lead Bonding
F0073-96R02 Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
F0076-86R02 Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors
F0078-97R02 Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards
F0083-71R02 Practice for Definition and Determination of Thermionic Constants of Electron Emitters
F0085-76R02 Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes
F0096-77R05 Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
F0097-72R02E01 Practices for Determining Hermeticity of Electron Devices by Dye Penetration
F0106-06 Specification for Brazing Filler Metals for Electron Devices
F0111-96R02 Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters
F0180-94R05 Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices
F0204-76R02 Test Method for Surface Flaws in Tungsten Seal Rod and Wire
F0205-94R05 Test Method for Measuring Diameter of Fine Wire by Weighing
F0219-96R02 Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
F0256-05E01 Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
F0269-60R02 Test Method for Sag of Tungsten Wire
F0288-96R02 Specification for Tungsten Wire for Electron Devices and Lamps
F0289-96R02 Specification for Molybdenum Wire and Rod for Electronic Applications
F0290-94R05 Specification for Round Wire for Winding Electron Tube Grid Laterals
F0357-78R02 Practice for Determining Solderability of Thick Film Conductors\t
F0358-83R02 Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers\t
F0364-96R02 Specification for Molybdenum Flattened Wire for Electron Tubes
F0375-89R05 Specification for Integrated Circuit Lead Frame Material
F0390-98R03 Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array
F0418-77R02 Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements
F0448-99R05 Test Method for Measuring Steady-State Primary Photocurrent
F0458-06 Practice for Nondestructive Pull Testing of Wire Bonds
F0459-06 Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
F0487-88R06 Specification for Fine Aluminum\N1 \% Silicon Wire for Semiconductor Lead-Bonding
F0508-77R02 Practice for Specifying Thick-Film Pastes\t
F0526-97R03 Test Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation Effects Tests
F0528-99R05 Test Method of Measurement of Common-Emitter DC Current Gain of Junction Transistors
F0584-06E01 Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
F0615M-95R02 Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components \[Metric\]
F0616M-96R03 Test Method for Measuring MOSFET Drain Leakage Current \[Metric\]
F0617 Test Method for Measuring MOSFET Linear Threshold Voltage
F0637 Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices
F0638 Specification for Fine Aluminum\M1 \% Magnesium Wire for Semiconductor Lead-Bonding
F0676-97R03 Test Method for Measuring Unsaturated TTL Sink Current
F0692-97R02 Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
F0744M-97R03 Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits \[Metric\]
F0769 Test Method for Measuring Transistor and Diode Leakage Currents
F0773M-96R03 Practice for Measuring Dose Rate Response of Linear Integrated Circuits \[Metric\]
F0798-97R02 Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region\t
F0816-83R03 Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages
F0979-86R03 Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding
F0980M-96R03 Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices \[Metric\]
F0996-98R03 Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current\NVoltage Characteristics
F1094-87R05 Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
F1190-99R05 Guide for Neutron Irradiation of Unbiased Electronic Components
F1192-00R06 Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
F1211-89R01 Specification for Semiconductor Device Passivation Opening Layouts
F1212-89R02 Test Method for Thermal Stability Testing of Gallium Arsenide Wafers
F1238-95R03 Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
F1259M-96R03 Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration \[Metric\]
F1260M-96R03 Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations \[Metric\]
F1261M-96R03 Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line \[Metric\]
F1262M-95R02 Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits [Metric]
F1263-99R05 Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
F1269-06 Test Methods for Destructive Shear Testing of Ball Bonds
F1367-98R03 Specification for Chromium Sputtering Targets for Thin Film Applications
F1372-93R05 Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components
F1373-93R05 Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components
F1374-92R05 Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components
F1375-92R05 Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components
F1376-92R05 Guide for Metallurgical Analysis for Gas Distribution System Components
F1394-92R05 Test Method for Determination of Particle Contribution from Gas Distribution System Valves
F1396-93R05 Test Method for Determination of Oxygen Contribution by Gas Distribution System Components
F1397-93R05 Test Method for Determination of Moisture Contribution by Gas Distribution System Components
F1398-93R05 Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components
F1404-92R99 Test Method for Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique
F1438-93R05 Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components
F1466-99R05 Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications
F1467-99R05 Guide for Use of an X-Ray Tester (|mF10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
F1512-94R03 Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
F1513-99R03 Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
F1570-01E01 Test Method for Determining the Tactile Ratio of a Membrane Switch
F1578-01 Practice for Contact Closure Cycling of a Membrane Switch
F1593-97R02 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer
F1594-95R03 Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications
F1595-00R05 Practice for Viewing Conditions for Visual Inspection of Membrane Switches
F1596-00R05 Practice for Exposure of Membrane Switches to Temperature and Relative Humidity
F1597-02 Test Method for Determining the Actuation Force and Contact Force of a Membrane Switch
F1598-95R02 Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method)
F1661-96R02 Test Method for Determining the Contact Bounce Time of a Membrane Switch
F1662-04 Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch
F1663-95R02 Test Method for Determining the Capacitance of a Membrane Switch
F1680-02 Test Method for Determining Circuit Resistance of a Membrane Switch
F1681-96R02 Test Method for Determining Current Carrying Capacity of a Conductor as Part of a Membrane Switch Circuit
F1682-02 Test Method for Determining Travel of a Membrane Switch
F1683-05E01 Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component
F1684-06 Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications
F1689-05 Test Method for Determining the Insulation Resistance of a Membrane Switch
F1709-97R02 Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
F1710-97R02 Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer
F1711-96R02 Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method
F1761-00R05 Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets
F1762-02 Practice for Exposing a Membrane Switch to Variation in Atmospheric Pressure
F1812-02 Test Method for Determining the Effectiveness of Membrane Switch ESD Shielding
F1842-02 Test Method for Determining Ink or Coating Adhesion on Plastic Substrates for Membrane Switch Applications
F1843-97R02 Practice for Sample Preparation of Transparent Plastic Films for Specular Gloss Measurements, on Membrane Switch Overlays
F1844-97R02 Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
F1845-97R02 Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer
F1892-06 Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
F1893-98R03 Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
F1894-98R03 Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness
F1895-98R04 Practice for Submersion of a Membrane Switch
F1896-98R04 Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
F1995-00R05 Test Method for Determining the Bond Strength of a Surface Mount Device (SMD) on a Membrane Switch by Applying Shear Force
F1996-06 Test Method for Silver Migration for Membrane Switch Circuitry
F1997-99R05 Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch
F2072-01 Practice for Hosedown of a Membrane Switch
F2073-01R06 Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch
F2086-01 Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2
F2112-02 Terminology for Membrane Switches
F2113-01E01 Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
F2114-02 Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch
F2187-02 Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
F2188-02 Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
F2357-04 Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool |P`RCA|P' Abrader
F2358-04 Guide for Measuring Characteristics of Sapphire Substrates
F2359-04 Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source
F2360-04 Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source
F2405-04 Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
F2576-06A Terminology Relating to Declarable Substances in Materials
F2577-06 Guide for Assessment of Materials and Products for Declarable Substances
F2592-06 Test Method for Measuring the Force-Displacement of a Membrane Switch